Instructions for Use

Mixed – Use manual or automated equipment to mix the A and B components uniformly according to the specified weight ratio, ensuring thorough mixing. In applications sensitive to air entrainment, the mixed adhesive should be subjected to vacuum degassing at a pressure of at least –0.09 MPa for 3–5 minutes; extend the degassing time as necessary when handling larger volumes of adhesive. For large‑scale production, consider using automated metering, mixing, and dispensing equipment.

Perfusion – Manual potting may be used, or an automated potting system equipped with a vacuum‑extraction unit and a material‑tank heating system may be employed. Place the component to be potted horizontally with the opening facing upward, and within the working time, pour in the potting compound and allow it to self‑level.

Curing – Simply cure the product at the temperature specified in its technical data sheet. For addition-cure systems, the curing time is highly dependent on temperature, part dimensions, and the thermal conductivity of the material being encapsulated. In short, the higher the temperature to which the compound is heated, the faster it will cure.

Here, with respect to the relationship between curing temperature and time, “time” refers to the curing duration after the material has reached the target temperature. The oven’s own heating-up process, components with substantial thermal mass, or other factors that might delay the material’s attainment of the target temperature should all be taken into account.

Precautions

The A and B components must be weighed precisely according to the specified ratio, and after mixing, they must be thoroughly stirred to ensure uniformity and prevent any adverse effects on the curing process.

HNGel 5271 exhibits poor curing when in contact with sulfur‑containing, ammonia‑bearing, unsaturated hydrocarbon plasticizers, and organometallic compounds—particularly organotin compounds. Common substances that can cause this issue include rosin and natural rubber. If it is uncertain whether a particular material will inhibit curing, a compatibility test should be conducted first.

HNGel 5271 recommends a mixing ratio of A:B = 1:1; after curing, the gel is soft and tacky. Increasing the amount of component B will produce a harder, less tacky gel, while increasing the amount of component A will yield a softer, more adhesive gel. Due to packaging constraints, we only accept orders at an A:B ratio of 1:1. Customers may adjust the ratio as needed to achieve their desired level of hardness and adhesion.

Storage and Shelf Life

HNGel 5271, when stored in its original sealed factory packaging at a temperature between 5 and 30°C, has a shelf life of at least 12 months. The expiration date is indicated on the label of each product’s outer packaging. Products that have exceeded their expiration date may only be used after their performance has been verified to be within acceptable limits.

Warning Information

Before using this product or any Hinnel product, please refer to the Material Safety Data Sheet (MSDS) and the product label for instructions on safe use and handling. If you have any questions, please feel free to contact us.

Frequently Asked Questions:

A common issue encountered during the application of addition‑cure silicone thermally conductive potting compounds is “poisoning.” This phenomenon occurs when the silicone gel, during curing, comes into contact with compounds containing nitrogen, phosphorus, sulfur, tin, lead, mercury, arsenic, and similar elements, which inhibit the activity of the platinum catalyst and result in incomplete cure at the affected areas.

Common substances that can cause poisoning include: natural rubber, sulfur‑containing and ammonia‑based plasticizers, unsaturated hydrocarbon plasticizers, organometallic compounds (particularly organotin compounds), soldering fluxes, rosin, incompletely cured condensation‑type silicone sealants, amine‑cured epoxy resins, and lead‑containing PVC wiring, among others.

Solution:

Choosing our company’s products with excellent anti-poisoning performance can address certain poisoning-related issues.

If poisoning is caused by excessive rosin residue on the circuit board surface, the board must be cleaned with board‑cleaning solvent before potting.

If the poisoning is caused by silicone sealant or ammonia‑cured epoxy resin, please contact our company for recommendations on high‑performance alcohol‑free titanium‑cured sealants or addition‑cure epoxies that do not contain ammonia.

If poisoning is caused by PVC tubing, it can be replaced with silicone tubing; if poisoning is caused by rubber gloves, silicone rubber gloves may be used.

Shanghai Hinnel provides innovative adhesive solutions for bonding, sealing, potting, thermal management, and protection. Our team works closely with customers to help enhance the value of their products. In an ever-evolving market, we continuously innovate and respond swiftly, committed to delivering professional products and technical support to customers worldwide.