Method of Use (Ammonia-Based Low-Viscosity System with Fillers)

Mixed – Before mixing, check whether the filler in the resin has settled; if so, stir it thoroughly to ensure uniformity. If necessary, preheat the resin to 40–50°C to facilitate blending. Use manual or automated equipment to mix components A and B uniformly according to the specified weight ratio, ensuring complete homogeneity. For large‑scale production, consider employing automated metering, mixing, and dispensing systems.

Perfusion – Manual potting may be used, or an automated potting system equipped with a stirring unit, a resin‑heating device, and vacuum equipment may be employed. Place the component to be potted horizontally with the opening facing upward, and within the working time, pour in the potting compound and allow it to self‑level.

Curing – Cure the product at the temperature specified in its technical specifications; if the ambient temperature is low, extend the curing time as needed. For larger‑sized products with substantial potting volumes, apply the compound in multiple stages or reduce the curing temperature to prevent excessive heat generation from degrading product performance.

Cleaning – When working with epoxy resins, it is recommended to use disposable containers and tools. If disposable materials are unavailable, equipment can be cleaned with a solvent to remove uncured potting compound. Solvent‑cleaned tools must be thoroughly dried before reuse; any residual solvent can contaminate subsequent operations.

Instructions for Use (Ammonia-Based Clear System, No Fillers)

Mixed – Use manual or automated equipment to mix the A and B components uniformly according to the specified weight ratio, ensuring thorough mixing. In applications sensitive to air entrainment, the mixed adhesive should be subjected to vacuum degassing at a pressure of at least –0.09 MPa for 3–5 minutes; extend the degassing time appropriately when handling larger volumes of adhesive. For large‑scale production, consider using automated metering, mixing, and dispensing equipment.

Perfusion – Manual potting may be used, or an automated potting system equipped with a resin‑heating unit and a vacuum‑extraction device can be employed. Place the component to be potted horizontally with the opening facing upward, and within the working time, pour in the potting compound and allow it to self‑level.

Curing – Cure at the temperature specified in the product’s technical data sheet. If the potting volume is small or the ambient temperature is low, extend the curing time as needed. For larger‑sized products with substantial potting volumes, apply the compound in multiple stages or reduce the curing temperature to prevent runaway exothermic reactions caused by excessive heat release.

Cleaning – When working with epoxy resins, it is recommended to use disposable containers and tools. If disposable materials are unavailable, equipment can be cleaned with a solvent to remove uncured potting compound. Solvent‑cleaned tools must be thoroughly dried before reuse; any residual solvent can contaminate subsequent operations.

Method of Use (Anhydride-Based High-Viscosity Filler-Containing System)

Mixed – Use manual or automated equipment to uniformly mix the A and B components according to the specified weight ratio until a consistent color is achieved. For large‑scale production, automated metering, mixing, and dispensing systems may be employed; however, care must be taken to prevent sedimentation in the delivery lines. Mechanical mixing is recommended within a sealed chamber; otherwise, air may be entrained into the sealant during the mixing process. Minimizing bubbles and voids is essential to optimize the electrical and thermal properties of the potting compound. Therefore, vacuum infusion is advised for critical applications.

Note: At low winter temperatures, Component A may become viscous and difficult to use. We recommend preheating it to 60°C in its original container. Before mixing the resin with the hardener, thoroughly stir Component A to prevent sedimentation (this procedure also applies to Component B in the HNEP 6300 and HNEP 6320 series). Be sure to mix each batch of material uniformly in its original container, especially if you have not used it all.

Potting – Operate manually or use automated metering, mixing, and dispensing equipment. In most cases, vacuum potting is recommended. For small parts or components with simple internal structures, direct potting is suitable; for larger parts or components with more complex internal structures, perform the potting in 2–3 stages.

Curing – Cure according to the curing temperature specified in the product’s technical specifications. For small parts, they can typically be removed from the oven and allowed to cool to room temperature immediately after curing. For larger parts, it is generally recommended to let them cool naturally in the oven until they reach room temperature before removing them.

Cleaning – When working with epoxy resins, it is recommended to use disposable containers and tools. If disposable materials are unavailable, equipment can be cleaned with a solvent to remove uncured potting compound. Solvent‑cleaned tools must be thoroughly dried before reuse; any residual solvent can contaminate subsequent operations.

Precautions

Components A and B must be weighed precisely according to the specified ratio. After mixing, stir thoroughly to ensure uniformity and avoid compromising the curing performance. If, prior to use, component A exhibits crystallization or clumping at low temperatures, melt it in an oven at 70–80°C, then allow it to cool to room temperature before application; this will not affect its properties. When heating, keep the container open to prevent damage. Use in a well-ventilated area. If contact with skin occurs, wash immediately with soap and water. If contact with eyes occurs, rinse thoroughly with water for an extended period while keeping the eyes open. If irritation persists, seek medical attention.

Storage and Transportation

This product is non‑hazardous. Store it away from light and heat in a sealed container; the shelf life is six months. Products past their expiration date may only be used after passing a performance inspection. Prolonged storage, storage under abnormal conditions, or use of resin that has expired may result in sedimentation or caking of the filler. Therefore, before use, carefully inspect the resin’s condition and thoroughly mix it by hand or with a mixer until uniform.

Note: The curing agent is highly sensitive to moisture; after adding the curing agent, any remaining product should be tightly sealed and stored immediately.

Warning Information

Before using this product or any product from Hinnel, please refer to the Material Safety Data Sheet (MSDS) and the product label for instructions on safe use and handling. If you have any questions, please feel free to contact us.

Frequently Asked Questions and Solutions

Abnormal appearance

Pattern imprint: Surface marring in epoxy potting compounds refers to the appearance of discrete, patchy marks on the cured surface, often accompanied by color variations. This issue is directly related to the sensitivity of the curing agent and ambient humidity. Control measures focus on the hygroscopicity of the curing agent and the level of moisture in the application environment: when the curing agent is highly hygroscopic and the ambient humidity is high, the likelihood of marring increases. Therefore, to mitigate marring in epoxy potting compounds, either select a curing agent with lower hygroscopicity or reduce the ambient humidity.

Wrinkling: Wrinkling in epoxy potting compounds refers to surface irregularities—such as waves, unevenness, or a honeycomb‑like texture—that appear after the compound has cured. This issue is largely linked to the intensity of the curing reaction: the more vigorous the exotherm, the shorter the effective self‑leveling window, making it difficult for any wrinkles to be smoothed out. The greater the amount of resin mixed, the more intense the reaction; therefore, for applications involving large volumes of potting compound, consider performing multiple potting cycles. Additionally, from a material‑performance standpoint, wrinkling is also influenced by the degree of cure‑induced shrinkage. For product‑specific recommendations, please contact us.

Stye: Pinholes in epoxy potting compounds refer to numerous tiny, raised protrusions on the cured surface. This issue is closely related to air bubbles: pinholes form when small bubbles fail to rupture during the degassing process, and the resin thickens and cures before they can escape. To address pinholing, three approaches are recommended: first, extend the curing time; second, enhance the defoaming performance of the epoxy potting compound; and third, perform vacuum degassing prior to application.

Whitening: The whitening phenomenon is most noticeable in black or transparent epoxy potting compounds, where the color difference is readily apparent. This issue tends to occur more frequently in winter, as low ambient temperatures—combined with prolonged room‑temperature storage—can lead to crystallization of the adhesive. By contrast, short‑term storage at low temperatures generally does not result in crystallization. To address this, simply heat the precipitated components, stir thoroughly, and then proceed with mixing and application; this will eliminate the whitening caused by curing.

Oil droplets: Surface oiling occurs because of an excess of curing agent. Since the curing agent is lighter than the base resin, after mixing the epoxy potting compound (A‑B system), the B component (curing agent) tends to rise to the top. We typically advise customers to pour the A component into the B component and stir thoroughly to prevent the curing agent from settling on the surface and being unevenly mixed. Under normal circumstances, epoxy potting compounds are formulated by weight ratio, so it is essential to use an electronic balance for accurate measurement to avoid an over‑dose of curing agent. An excessive amount of curing agent will not fully react chemically and, due to its lower density, will remain at the surface.

Pit: Pit formation occurs when air trapped in the epoxy potting compound cannot self‑level after the surface is breached, resulting in depressions. There are two primary causes: either the defoaming process is too slow or the curing rate is excessively fast. Therefore, from a product‑development perspective, it is essential to balance the defoaming speed with the curing rate and to minimize the generation of entrapped air bubbles during potting, typically by employing vacuum degassing.

Performance anomaly

Curing: During the curing process of epoxy potting compounds, issues such as incomplete curing or partial curing with some areas remaining uncured may occur. These problems are typically caused by an imbalance in the mix ratio—either due to incorrect proportions or uneven mixing during the blending stage.
During normal use, always follow the manufacturer’s recommended mixing ratios precisely. Use an electronic balance for weighing, and be sure to tare the scale before measuring. When stirring, make sure to thoroughly mix even the edges and bottom of the container.

Shedding: Epoxy potting compound delamination refers to the phenomenon where, after the adhesive is encapsulated within the housing and subjected to specific high- or low-temperature conditions or left at ambient temperature, it separates from the housing. Such delamination can compromise the product’s waterproofing and sealing performance.

In such cases, one possibility is that the amount of encapsulant injected in a single pour is too large, generating significant heat; after the adhesive cures, severe shrinkage occurs, leading to delamination. Another reason could be insufficient adhesion between the adhesive and the housing, causing it to separate under alternating thermal cycling. To address these issues, manufacturers should provide products with strong adhesion to the substrate and a low coefficient of thermal expansion. We welcome you to contact Shanghai Hinnel for recommendations on more suitable solutions.

Cracking: Cracking in epoxy potting compounds refers to the phenomenon where, after curing, the adhesive material develops cracks under specific high- and low-temperature conditions or during ambient‑temperature storage. Such cracking can significantly compromise the performance of the encapsulated product.

This situation typically arises for one of the following reasons: first, after curing, air bubbles may remain within the adhesive; under high‑ and low‑temperature cycling, these bubbles expand, causing the adhesive to crack. Second, if the adhesive has a high coefficient of thermal expansion, repeated thermal cycling can generate significant internal stresses, which, upon release, lead to cracking. In such cases, customers should contact the manufacturer to recommend an epoxy potting compound with a lower coefficient of thermal expansion and superior toughness.

Shanghai Hinnel provides innovative adhesive solutions for bonding, sealing, potting, thermal management, and protection. Our team works closely with customers to help enhance the value of their products. In an ever-evolving market, we continuously innovate and respond swiftly, committed to delivering professional products and technical support to customers worldwide.