Epoxy structural adhesive
Designed for applications that require
Applications involving high-strength structural bonding
Epoxy structural adhesives exhibit excellent bonding strength and durability, capable of withstanding substantial tensile, shear, and peel forces. They can join a wide range of components, delivering bond strengths that are superior to those achieved by riveting or welding—more uniform and free from stress concentrations. Moreover, they offer enhanced fatigue resistance, thereby improving the crack‑resistance and overall integrity of structural members.
At the same time, epoxy structural adhesives also exhibit excellent electrical insulation properties, as well as outstanding resistance to solvents, oils, acids, alkalis, and water.
The epoxy structural adhesive developed and manufactured by Hinnel in Shanghai boasts a broad temperature‑resistance range, maintaining stable performance under high‑temperature, low‑temperature, and harsh environmental conditions. It offers rapid bonding, requires no welding, is non‑corrosive, and exhibits excellent adhesion, heat resistance, and oil resistance to metals, ceramics, vulcanized rubber, glass‑fiber products, carbon‑fiber composites, and more.
Product applications: bonding and securing motors, coils, and magnetic cores; bonding and sealing relays and solenoid valves; bonding various metallic and non-metallic components; industrial bonding of honeycomb panels, sandwich panels, and similar materials; bonding components in rail transit and automotive manufacturing.
Hinnel Product Features
Single-component or two-component (1C or 2C)
A product line featuring various viscosity combinations
Various packaging sizes
Room-temperature/heat-curing
Excellent adhesion
Mechanical fatigue resistance
The temperature resistance range spans from -45 to 200°C.
High-temperature resistance, high toughness, and high strength
Excellent chemical resistance
Good electrical performance
Complies with RoHS and REACH environmental certifications.
2C two-component epoxy structural adhesive:
Product model |
Quality ratio |
Mixed viscosity |
Operation Time |
Curing time |
Curing hardness |
Color |
Shear strength |
Temperature resistance range |
Key Features |
| A:B | cps 25℃ |
min 25℃ |
h 25℃ |
Shore D |
Visual estimation |
Mpa |
°C |
||
HN6220T |
1:1 |
10,000~15,000 |
2-3 |
5min |
80 |
Transparent |
10-15 |
-40~120 |
High transparency, rapid curing, suitable for thin‑layer potting, wire harness fixation, frame bonding, and more. |
HN6220G |
1:1 |
70,000~90,000 |
3-5 |
10min |
80 |
Translucent |
10-15 |
-40~120 |
A fast-curing, semi-transparent paste, suitable for hole and joint sealing, wire harness securing, structural bonding, and more. |
HN6120HP |
2:1 |
20,000~30,000 |
90~120 |
24 |
80~85 |
Amber-colored |
20-25 |
-40~120 |
Long working time, high bond strength, high toughness, and high peel strength. Suitable for bonding most materials. |
HN6225G |
1:1 |
15,000~25,000 |
20-30 |
24 |
70-80 |
Light yellow |
10-15 |
-40~120 |
Low-viscosity thixotropic formulation with excellent toughness, suitable for bonding metals, ceramics, plastics, and more, delivering high bond and peel strengths. |
| HN6160HP | 2:1 | 55,000~75,000 | 30~50 | 24 | 85~90 | Gray | 20-25 | -40~200 | It can withstand temperatures of 180°C over the long term and maintains excellent adhesion even at this temperature. |
HN6012 |
1:1 |
Thixotropic paste |
40~60 |
24 |
40~50 |
Translucent |
10-15 |
-40~120 |
After curing, it exhibits excellent flexibility, ultra-high toughness, high peel strength, and outstanding adhesion performance. |
HN6015 |
1:1 |
Thixotropic paste |
5~10 |
30min |
70~80 |
Gray/White |
10-15 |
-40~150 |
Fast curing, high-temperature resistance, ultra-high toughness, high peel strength, and excellent adhesion. |
HN6160DR |
1:1 |
Thixotropic paste |
50~60 |
24 |
80~85 |
Gray/White |
10-15 |
-40~200 |
Thermally conductive structural adhesive with a thermal conductivity of 3.0, offering ultra-high toughness, high peel strength, and excellent bonding performance. |
1C single-component epoxy structural adhesive:
Product model |
Quality ratio |
Viscosity |
Storage time |
Curing time |
Curing hardness |
Color |
Shear strength |
Temperature resistance range |
Key Features |
| / | cps 25℃ |
d 25℃ |
/ |
Shore D |
Visual estimation |
Mpa |
°C | ||
HN6020 Series |
Single-component |
Thixotropic paste |
90 days |
150℃ × 30 min |
75~85 |
Black |
20~25 |
-40~200 |
Thixotropic, non‑dripping paste; can be applied vertically without sagging. Suitable for structural bonding or joint filling, it exhibits high toughness, excellent adhesion, and superior high‑temperature resistance after curing. |
HN6030 Series |
Single-component |
Micro-flow type |
30 days |
120℃ × 30 min |
75~85 |
Black |
15~20 |
-40~200 |
Thixotropic, semi-fluid formulation; suitable for structural bonding, joint filling, component fixation, and edge‑to‑frame sealing. It delivers high bond strength at the joint, with excellent impact resistance and vibration durability. |
HN6060 Series |
Single-component |
Flowing type |
15 days |
100℃ × 10 min |
75~85 |
Black |
15~20 |
-40~200 |
Low-viscosity, flowable formulation that cures rapidly at low temperatures, suitable for chip encapsulation, thin-layer potting, and edge‑to‑edge bonding and sealing. It delivers high bond strength, excellent impact resistance, and superior vibration durability. |
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Instructions for Use (Two-Component Epoxy Structural Adhesive)
Pre-processing – Clean and prepare the surface of the material to be bonded or coated, using a cleaning agent to remove rust, dust, oil, and other contaminants.
Mixed – 400 ml dual‑tube packaging: Rotate 90° to remove the cap, attach the mixing tube, and load it into a professional manual, electric, or pneumatic caulking gun. For greater reliability, discard the first few drops of adhesive extruded from the mixing tube to prevent initial uneven mixing that could compromise bonding performance. Note: The mixing tube is a consumable; if used beyond its recommended service life, replace it with a new one.
Kilogram packaging: Use manual or automated equipment to mix components A and B in the specified ratio, ensuring thorough blending. For large-scale production, automated metering, mixing, and dispensing systems may be employed.
Sizing – After mixing the adhesive, apply it evenly to both surfaces to be bonded within the working time, then bring the surfaces together and hold them in position. Do not move the bonded assembly until the adhesive has gelled. Apply appropriate pressure to the substrates as needed to ensure full contact with the adhesive, thereby achieving optimal bonding performance.
Curing – Cure the product under the conditions specified in its TDS. Before evaluating its overall performance, allow it to cure at room temperature for at least 7 days, or, after initial room‑temperature curing, perform a post‑cure step by heating—e.g., 80°C for 1 hour, or 80°C for 1 hour followed by 150°C for 1 hour. Post‑curing at elevated temperatures yields superior adhesive properties.
Note: Curing time is significantly influenced by temperature and the amount of adhesive applied; curing times may vary slightly under different temperature and application conditions.
Cleaning – When working with epoxy resins, it is recommended to use disposable containers and tools. If disposable materials are unavailable, equipment can be cleaned with a solvent to remove uncured resin. Solvent‑cleaned tools must be thoroughly dried before reuse; any residual solvent can contaminate subsequent operations.
Storage and Shelf Life
This product is non‑hazardous. Store it away from light and heat in a sealed container. When kept in its original, unopened packaging, it has a shelf life of 12 months. The expiration date is indicated on the label of each product’s outer packaging. Products past their expiration date may only be used after their performance has been verified to be within acceptable limits.
Note: Materials removed from the container may become contaminated during use; do not return the product to its original container for storage.
Precautions
1. Components A and B must be weighed precisely according to the specified ratio, and after mixing, they must be thoroughly stirred to ensure uniformity and avoid compromising the curing performance. In winter, when temperatures are low, the viscosity of both components A and B increases; preheating the materials to 25°C can facilitate application.
2. Before use, ensure that the components to be bonded and the container are clean, with no dust, oil, salts, or other contaminants on the surfaces, to avoid compromising the adhesive’s curing performance.
3. Some individuals may develop an allergic reaction to epoxy adhesive; if the adhesive comes into contact with the skin, wash it off promptly with soap.
4. It is important to note that low temperatures can significantly affect epoxy resins, influencing their curing process, crystallization, and viscosity, and may even lead to condensation inside the container. Cold temperatures slow down the curing process, render the material more brittle, result in suboptimal final‑product performance, reduce material strength, and diminish durability. At the same time, increased viscosity makes mixing and application of the epoxy resin more challenging.
Therefore, during cold winter conditions, preheating and raising the curing temperature are critical for ensuring product performance.
Warning Information
Before using this product or any Hinnel product, please refer to the Material Safety Data Sheet (MSDS) and the product label for instructions on safe use and handling. If you have any questions, please feel free to contact us.
Instructions for Use (Single-Component Epoxy Structural Adhesive)
Pre-processing – Clean and prepare the surface of the material to be bonded or coated, using a cleaning agent to remove rust, dust, oil, and other contaminants.
Warming up – Single-component epoxy adhesive should be stored at low temperatures when not in use for extended periods. Before application, remove the product from refrigeration and avoid opening it immediately; allow it to come to room temperature for approximately two hours to ensure proper warming (the exact time depends on package size and ambient conditions). Prior to opening, wipe any moisture from the exterior of the container to prevent introducing water into the adhesive, which could compromise its performance. To accelerate the warming process, circulating water may be used, but care must be taken to keep it dry. Alternatively, the adhesive can be warmed in an oven, provided the oven temperature does not exceed 30°C.
Sizing – Apply the adhesive directly to the surfaces of the substrates, which have been degreased, derusted, and roughened. Use an appropriate tool to assist with application, secure the parts with a fixture, and then cure them in equipment maintained at the temperature required for curing. For potting and sealing applications, no fixation is necessary; simply heat the assembly to effect curing.
Curing – Cure the product under the conditions specified in its TDS. The curing time refers to the duration maintained after the adhesive temperature has reached the designated level. Therefore, for large‑volume or deeply recessed parts that conduct heat slowly, you should either moderately increase the curing temperature or extend the curing time to ensure complete cure. During curing, excessive adhesive application or excessively high temperatures may lead to bubble formation; in such cases, please reduce the curing temperature accordingly.
Cleaning – When working with epoxy resins, it is recommended to use disposable containers and tools. If disposable materials are unavailable, equipment can be cleaned with a solvent to remove uncured resin. Solvent‑cleaned tools must be thoroughly dried before reuse; any residual solvent can contaminate subsequent operations.
Storage and Shelf Life
This product is non‑hazardous. Store it away from light and heat in a sealed container. When stored in its original, unopened packaging in a freezer at –5°C, it has a shelf life of 6 months. The expiration date is indicated on the label of each product’s outer packaging. Products past their expiration date may only be used after passing a performance inspection.
Note: As this product is a chemical that reacts when exposed to heat, ambient temperature significantly affects its quality. Please store it in a cool environment to ensure stability and maintain product quality. Any unused gel remaining after removal should be promptly resealed and returned to frozen storage.
Precautions
1. Single-component epoxy adhesives are highly sensitive to temperature during curing. The curing times specified above refer to the duration maintained once the adhesive has reached the designated temperature. If the adhesive temperature fails to reach the required level, the curing time may be significantly prolonged, or the adhesive may not cure at all. For large‑volume or deeply embedded components with poor thermal conductivity, it is advisable to moderately increase the curing temperature or extend the curing time to ensure complete cure. During curing, excessive adhesive application or excessively high temperatures can lead to bubble formation; in such cases, please reduce the curing temperature accordingly.
2. During use, minimize direct contact with skin. In very rare cases, prolonged exposure to the adhesive may cause mild skin irritation, including slight itching and discomfort. We recommend wearing protective gloves when handling. If the adhesive gets on your skin, wipe it off with acetone or alcohol, then wash thoroughly with a cleanser or soap.
3. Prolonged exposure to direct sunlight or ultraviolet radiation should be avoided, as it may degrade the adhesive’s quality or render it unusable due to unintended chemical reactions.
4. Do not expose to outdoor humid and hot conditions to prevent moisture ingress from causing quality issues.
Warning Information
Before using this product or any Hinnel product, please refer to the Material Safety Data Sheet (MSDS) and the product label for instructions on safe use and handling. If you have any questions, please feel free to contact us.
Shanghai Hinnel provides innovative adhesive solutions for bonding, sealing, potting, thermal management, and protection. Our team works closely with customers to help enhance the value of their products. In an ever-evolving market, we continuously innovate and respond swiftly, committed to delivering professional products and technical support to customers worldwide.
The product’s TDS, MSDS, RoHS, REACH, and other relevant documents can be obtained via the following methods:
✓ Online Message on This Site
✓ Email: sales@hinnel.com
✓ Phone: 021-57896706
✓ Our company’s official WeChat account: Shanghai Hinnel New Materials Technology Co., Ltd.
✓ Please contact our relevant sales representatives directly to obtain it.