Silicone thermal conductive potting adhesive
Designed for potting and protecting electronic products that require thermal conductivity and waterproof conditions.
Hinnel silicone potting glue is a room temperature/warm curing electronic potting material. After curing, it forms an elastic cushioning material with excellent high and low temperature resistance and weather resistance, while also possessing good electrical performance and chemical stability.
The high thermal conductivity of this series of products makes it an ideal choice for applications with heat dissipation requirements. Hinnel offers a variety of products with different thermal conductivity coefficients, which can effectively conduct heat away from your components to ensure low thermal stress. Even under conditions of significant temperature fluctuations, the material can maintain sufficient elasticity to reduce stress within the components.
Hinnel can provide a variety of innovative products including non-adhesive, self-adhesive, and adhesive types, and can adapt to customer requirements for curing time, viscosity, hardness, and other indicators, fully committed to providing the best solutions for customer applications.
Product applications: potting, sealing, and thermal conductivity, protecting electronic components from external moisture and pollution; thermal potting for power supplies, controllers, and high-power heating devices; insulation and waterproof potting for sensors and small electronics; sealing, thermal conductivity, and noise reduction for coils; shock protection for precision electronic components; waterproof potting for lamps and junction boxes; thermal potting for lithium battery packs and electric control in new energy vehicles.
Hinnel Product Features
Good fluidity
Excellent electrical performance
Flame retardant performance meets UL94-V0 requirements
Excellent thermal conductivity
Thermal conductivity ranges from 0.6 to 3.5 W/m.k
Environmentally friendly, solvent-free, no curing by-products
Can cure at room temperature or be rapidly cured with heat
No exothermic reaction during curing, no shrinkage
Reduces mechanical stress and tension caused by mechanical, thermal shock, and vibration
Excellent high and low temperature resistance, can maintain elasticity from -50 to 250℃
| Model | Quality Ratio | Mixing Viscosity | Operation Time | Curing Time | Hardness | Thermal Conductivity Coefficient | Flame Retardant Level | Temperature Range | Color | Main Characteristics |
| A:B | cps/25℃ | min/25℃ | ℃/min | shoreA | w/m.k | UL94 | ℃ | - | ||
| HNSIL8730 | 1:1 | 3500±500 | 55±10 | 25℃×10h or 80℃×30min | 55A | 0.8 | V-0 | -50~250 | Black/Grey | Thermal conductive flame retardant anti-poisoning silicone potting adhesive, good permeability, long operation time, fast curing speed. Suitable for potting coils, circuit boards, etc. |
| HNSIL8720 | 1:1 | 3500±500 | 100±20 | 25℃×12h or 80℃×30min | 35A | 1.2 | V-0 | -50~250 | Black/Grey | Long operation time, low hardness, high thermal conductivity, flame retardant, anti-poisoning silicone potting adhesive, good permeability, long operation time, fast curing speed. |
| HNSIL8730-1.5 | 1:1 | 5500±100 | 60±10 | 25℃×12h or 80℃×30min | 65A | 1.5 | V-0 | -50~250 | Black/Grey | High thermal conductive silicone potting adhesive, high thermal conductivity, high hardness. |
| HNSIL8730-2.0 | 1:1 | 8500±500 | 120±20 | 25℃×24h or 80℃×30min | 70A | 2.0 | V-0 | -50~250 | Black/Grey | High thermal conductive silicone potting adhesive, high thermal conductivity, high hardness. |
| HNSIL8730-3.0 | 1:1 | 13000±3000 | 80±30 | 25℃×24h or 80℃×30min | 50 (00) | 3.0 | V-0 | -50~250 | Pink | Soft, low hardness, good adhesion to heating devices, high thermal conductivity. |
| HNSIL8730N | 1:1 | 4000±500 | 60±10 | 25℃×10h or 80℃×30min | 0 (00) | 0.6 | V-0 | -50~250 | Grey | Self-adhesive silicone thermal conductive potting adhesive, has adhesion to devices and housings, used for potting micro inverters, etc. |
| HNSIL8715 | 10:1 | 900±200 | 50±10 | 25℃×24h | 30A | 0.2 | - | -50~200 | Black | Condensation type silicone thermal conductive potting adhesive, low viscosity can cure quickly at depth, suitable for potting with more rosin residue on circuit boards, will not cause poisoning. |
| HNSIL8715T | 10:1 | 500±200 | 50±10 | 25℃×24h | 30A | 0.2 | - | -50~200 | Transparent | Condensation type low viscosity silicone potting adhesive, has adhesion, can be repaired. |
| HNSIL8715H | 10:1 | 1200±300 | 50±10 | 25℃×24h | 50A | 0.3 | - | -50~200 | Black | Condensation type silicone potting adhesive, high hardness, high strength. |
| HNSIL8715HB | 10:1 | 3000±500 | 30±10 | 25℃×24h | 50A | 0.6 | V-0 | -50~200 | Grey | Thermal conductive flame retardant condensation silicone potting adhesive, has adhesion, suitable for potting with more rosin residue on circuit boards, will not cause poisoning. |
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Instructions For Use (HNSIL8730 series silicone thermal conductive sealant)
Mixing - Before mixing and dispensing, check whether the fillers in each component have precipitated. If there is precipitation, it must be stirred evenly first. Then, manually or automatically mix the A/B components in proportion (weight ratio) until the color is uniform. For large-scale production, automatic measuring/mixing/gluing equipment can be used.
Pouring - Can be done manually or with automatic sealing equipment equipped with mixing devices and material tank insulation devices. Place the pouring port of the component to be sealed horizontally upwards, pour in the sealing glue within the operable time, and self level.
Curing - Cure according to the curing temperature specified in the product technical parameters. The curing time of the additive product largely depends on the temperature, size, and thermal conductivity of the product used for sealing. In short, the higher the temperature at which colloids are heated, the faster they solidify.
In terms of the relationship between curing temperature and time, time refers to the curing time after the material reaches the target temperature. Consideration should be given to the heating process of the oven itself, components with strong heat storage capacity, or other situations that may delay the material from reaching the target temperature.
Precautions
The A/B components should be weighed strictly in proportion, and after mixing, they must be stirred evenly to avoid affecting the curing effect.
Adding organic silicon thermal conductive sealant to materials containing sulfur, ammonia, unsaturated hydrocarbon plasticizers, organic metal compounds - especially organotin compounds - can make it difficult to harden. Common substances include rosin, natural rubber, etc. If you don't know if a substance will hinder curing, you should first conduct a test to verify their compatibility.
Storage and Shelf Life
This product is non hazardous and should be stored in a sealed manner away from light and heat, with a shelf life of 12 months. To avoid long-term settling, A/B components must be regularly flipped inside the original container to maintain the longest shelf life. Products that have exceeded their shelf life must be tested for normal performance before they can be put into use.
If the filler settles or clumps during long-term storage, it must be stirred evenly by hand or a blender before use.
Warning Message
Before using this product or any product from Shanghai Hinnel, please refer to the Material Safety Data Sheet (MSDS) and the instructions on safe use and handling on the product label. If you have any questions, please feel free to contact us at any time.
Common Problem:
A common problem with the use of addition molding silicone thermal conductive sealing adhesive is poisoning. Poisoning refers to the phenomenon where the adhesive comes into contact with compounds containing N, P, S, Sn, Pb, Hg, As, etc. during the curing process, which affects the activity of PT platinum catalyst and causes the contact part to not cure.
Common substances that can cause poisoning include natural rubber, sulfur-containing, ammonia, unsaturated hydrocarbon plasticizers, organometallic compounds (especially organotin compounds), soldering flux, rosin, incompletely cured condensed silicone sealant, ammonia cured epoxy resin, lead containing PVC wire, etc.
Solution:
Choosing our company's excellent anti poisoning products can solve some poisoning problems.
If poisoning is caused by excessive residual rosin on the surface of the road board, it should be cleaned with board washing water before gluing the product.
If poisoning is caused by silicone sealant or ammonia cured epoxy resin, please contact our company to recommend excellent dealcoholized titanium or additive sealant or non ammonia epoxy resin.
If PVC wire causes poisoning, silicone wire can be replaced for use. If rubber gloves cause poisoning, silicone rubber gloves can be used.
Usage (HNSIL 8715 series condensed organic silicon thermal conductive sealant)
Mixing - Before mixing and dispensing, check whether the filler in component A has precipitated. If there is precipitation, it must be stirred evenly first (this operation is not required for transparent systems). Then, manually or automatically mix the A/B components in proportion (weight ratio), and for large-scale production, automatic measuring/mixing/gluing equipment can be used.
Pouring - Can be done manually or automatically with a mixing device. Place the pouring port of the component to be sealed horizontally upwards, pour in the sealing glue within the operable time, and self level.
Curing - Room temperature static curing. The curing time of condensation type products largely depends on the catalyst and environmental humidity. The curing of colloids is gradual from the surface to the inside, so the surface will cure faster and the bottom of the colloids will cure slower. Typically, condensation type potting adhesives take 7 days to fully cure.
Precautions
The A/B components should be weighed strictly in proportion, and after mixing, they must be stirred evenly to avoid affecting the curing effect.
Storage and Shelf Life
This product is non hazardous and should be stored in a sealed manner away from light and heat, with a shelf life of six months. Products that have exceeded their shelf life must be tested for normal performance before they can be put into use.
If the filling material of component A settles or clumps during long-term storage, it must be stirred evenly by hand or a mixer before use.
Warning Message
Before using this product or any product from Shanghai Hinnel, please refer to the Material Safety Data Sheet (MSDS) and the instructions on safe use and handling on the product label. If you have any questions, please feel free to contact us at any time.
Shanghai Hinnel provides innovative adhesive solutions for bonding, sealing, potting, thermal conductivity, and protection. Our staff work closely with customers to help them increase the value of their products. In the ever-changing market, we constantly innovate, respond quickly, and are committed to providing professional products and technical support to global customers.
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