Polyurethane potting adhesive
Excellent high and low temperature stability,
Designed for flexible, low-stress waterproof potting protection
The basic principle of polyurethane potting adhesive is the cross-linking curing of polyol resin and MDI curing agent under the action of a catalyst, forming a polymer. To achieve better bonding sealing, heat resistance, thermal conductivity, toughness, elasticity, and low stress functions, we need to make some improvements to ensure good thermal strength, mechanical properties, and insulation stability.
Hinnel has a wide range of innovative polyurethane potting adhesive products, which maintain good thermal stability even at continuous operating temperatures of up to 165°C, making the products suitable for demanding application requirements and expanding their application range. The fillability of the resin part significantly improves thermal conductivity, allowing designers to achieve excellent heat dissipation.
Hinnel's polyurethane potting adhesive has a variety of mechanical properties, including gel characteristics, elastomer characteristics, impact resistance, and large size stability. Transparent UV-resistant solutions can also be provided for transparent applications.
Product applications:
Potting protection for automotive electronic devices, sensors, electronic appliances, etc.; effective protection and insulation for electrical and electronic devices such as transformers, chokes, and capacitors, ensuring uniform heat dissipation; thermal waterproof potting for industrial power supplies and controllers; waterproof potting protection for new energy vehicle charging guns, and other industries.
Hinnel Product Features
Good fluidity, excellent self-defoaming performance
Good permeability
Good electrical performance
Good adhesion to plastics, metals, glass, etc.
Excellent heat resistance and thermal conductivity
High mechanical strength
Low water absorption, resistant to high temperature and high humidity (tested under 1000 hours of wet heat conditions at 85% relative humidity and 85°C)
Resistant to thermal shock and thermal cycling
| Model | Quality Ratio | Mixing Viscosity | Operation Time | Curing Time | Curing Hardness | Flame Retardant Level | Color | Main Characteristics |
| A:B | cps 25℃ | min 25℃ | hr 25℃ | Shore | UL-94 | - | ||
| PU500H | 100:50 | 650±200 | 20~30 | 24~72 | 75A | - | Colorless and Transparent | Colorless and pure transparent, used for LED light strips, smart water meters, and optical device potting, with excellent waterproof performance, fast curing speed, low exothermicity, high colloidal strength, and good toughness. |
| PU500D | 100:100 | 400±200 | 20~30 | 24~72 | 50D | - | Colorless and Transparent | Colorless and pure transparent, resistant to yellowing, high hardness, high toughness, adjustable curing speed, suitable for waterproof protection of electronic devices. |
| PU510F | 100:60 | 400±200 | 10~20 | 24~72 | 50D | - | Yellow Transparent | Acid and alkali resistant, hydrolysis resistant, low mixing viscosity, low exothermicity, strong adhesion to materials such as plastics and metals, suitable for water treatment filter membrane packaging. |
| PU550 | 100:20 | 500±200 | 50±10 | 12~24 | 80A | V-0 | Black | Very low viscosity, excellent self-degassing performance, can be manually or machine injected without bubbles, resistant to dual 85, with a bright and smooth surface. |
| PU550D | 100:20 | 800±500 | 30~40 | 24~72 | 80A | V-0 | Black | Very good resistance to dual 85, resistance to thermal shock, suitable for machine injection and heating curing, with good adhesion to metals, plastics, and wire harnesses, suitable for film capacitors, controllers, and automotive-grade sensor potting. |
| PU550-2 | 100:16 | 900±100 | 30±10 | 24~72 | 80A | V-0 | Black | Excellent resistance to dual 85 (can withstand over 1000 hours), excellent resistance to thermal shock (-45~125℃), with good adhesion to metals, plastics, and wire harnesses, suitable for automotive electronic sensor potting. |
| PU512 | 100:11 | 30000±10000 | 5±2 | 8~15min | 85A | V-0 | Black | Excellent resistance to dual 85, resistance to thermal shock, very fast curing speed, suitable for new energy vehicle charging gun potting. |
| PU515 | 100:33.3 | 500±200 | 30±10 | 24~72 | 50A | HB | Black | Resistant to low temperatures, excellent electrical insulation, good toughness, high elongation, with good adhesion to metals, quantities, and rubber. Resistant to dual 85 and thermal shock. |
| PU558 | 100:25 | 750±200 | 30~50 | 24~72 | 80D | V-0 | Black | Low viscosity, good fluidity, good gloss of the cured product, high hardness, high strength, high toughness, with good adhesion to metals and engineering plastics. |
Our products are more than that · · · ·
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Usage
Mixing- Before mixing and dispensing, check whether the filler in component A has precipitated. If there is precipitation, it must be stirred evenly first (this operation is not required for transparent systems). Then use manual or automatic equipment to evenly mix the A/B components in proportion (weight ratio), making sure to stir evenly. In situations where gas mixing is sensitive, the mixed adhesive solution needs to be vacuumed at a vacuum degree of -0.09MPa or above for 3-5 minutes. When there is a large amount of colloid, the degassing time should be appropriately extended to remove the bubbles mixed into the adhesive due to mixing. Otherwise, there is a certain probability of bubbles appearing inside and on the surface of the injected adhesive. Large scale production can use automatic measuring/mixing/gluing equipment.
Pouring - Manual sealing can be used, or automatic sealing equipment with vacuum pumping device, mixing device, and material cylinder insulation device (transparent system does not require mixing device) can be used to place the pouring port of the part to be filled horizontally upwards, pour the sealing glue and self level within the operable time. Devices with complex structures and large volumes should be poured in stages. Pouring bubbles can be blown with a hot air gun or other tools to eliminate surface bubbles.
Curing - It is recommended to let it stand in an environment of 20 ℃~30 ℃ for better elimination of bubbles, or to heat it at low temperature for curing when there are no obvious bubbles inside or on the surface of the colloid. The curing time is related to the amount and temperature of each mixture. When the amount is large or the temperature is high, the curing time will be relatively shortened, and conversely, the curing time will be prolonged. Catalysts will greatly shorten the curing time.
Cleaning - The resin before curing is relatively easy to clean. After curing, the resin should be soaked in specialized cleaning agents (such as thinner, dichloromethane, board wash water, etc., but it is not ruled out that cleaning agents may corrode other components besides glue, please use with caution), softened, and peeled off.
Precautions
At low temperatures, the viscosity of material A will increase, while material B is prone to crystallization. Preheat the material to 25 ℃~45 ℃ to increase the fluidity of the adhesive and prevent excessive viscosity and the generation of too many bubbles. This product is sensitive to moisture, which can cause solidification bubbles. It is recommended to control the operating environment at 25 ± 5 ℃ and the humidity should be controlled below 60%. PCB boards or plastic shells that are prone to moisture absorption should be dried before sealing, otherwise small bubbles may form at the edges of the board and plastic shell.
Storage and Shelf Life
This product is non hazardous, protected from light, insulated, dry, and stored in its original unopened container at a temperature of 15-25 ° C. The shelf life of each component is six months from the date of manufacture. The shelf life is marked on the label on the outer packaging of each product. Products that have exceeded their shelf life must be tested for normal performance before they can be put into use.
If the filler of material A settles or clumps during long-term storage, it must be stirred evenly by hand or a mixer before use (this operation is not required for transparent systems).
Attention: The curing agent is very sensitive to moisture, and after adding the curing agent, the remaining curing agent should be immediately stored in a sealed container. A/B materials should be used up in one go after opening, or sealed again after filling the bucket with nitrogen gas.
Warning Message
Before using this product or any product from Shanghai Hinnel, please refer to the Material Safety Data Sheet (MSDS) and the instructions on safe use and handling on the product label. If you have any questions, please feel free to contact us at any time.
Phenomenon (abnormal situation) | Reason | Measure |
Component B is turbid and crystalline | 1. Poor sealing of packaging drums; 2. The customer did not use up the bucket in a timely manner after opening it; 3. The MDI in material B reacted chemically with water vapor to form crystals (which have become ineffective); | After opening the bucket, customers need to use it up in a timely manner. If it is not used up, it should be immediately sealed and stored in a dry and cool place. |
| Component A precipitation | The higher the temperature, the longer the time, and the more severe the sedimentation of the filler | Control the storage temperature and use it up as soon as possible. Before use, use a dry stirring rod to stir evenly before use. |
| Surface bubbles | 1. The on-site humidity is too high (chemical bubbles); 2. Adhesive or sealing products become damp (chemical bubbles); 3. The distribution ratio of A/B after opening the bucket is imbalanced, and the proportion of B material is too high (chemical bubbles); 4. The internal structure of the sealed product is complex, resulting in excessive resistance to the release of adhesive bubbles (physical bubbles); 5. The glue has not undergone vacuum degassing treatment (physical bubbles); | 1. The on-site humidity should be controlled below 55% RH; 2. The product to be sealed needs to be dehumidified in advance and the glue should be checked for moisture; 3. After separating the A/B groups into buckets, they should be used up as soon as possible. If they are not used up, they should be sealed and stored. Before each glue injection, check whether the equipment ratio is correct; 4. Seal multiple times and blow the bubbles with a hot air gun; 5. Before gluing, the glue should undergo vacuum defoaming treatment; |
| 1. Adhesive sticks to hands 2. Hardening 3. Don't do it 4. Local non drying 5. Appearance oil surface and pattern | 1. Imbalance in proportion, with a surplus of material A; 2. Imbalance in proportion, with an excess of material B; 3. Not stirred evenly, or there is too much A material; 4. Insufficient mixing and uniformity; 5. The precipitation of component A is not stirred evenly or the environmental humidity is high; | 1. The proportion of material A is relatively large. It is recommended to recheck the equipment and adjust the ratio; 2. The proportion of B material is relatively large, it is recommended to recheck the equipment and adjust the ratio; 3. Mix thoroughly and check the ratio; 4. Mix thoroughly and evenly, while also ensuring that the walls and bottom of the mixing container are stirred thoroughly; 5. Material A has sediment, it needs to be stirred evenly in the original bucket before use, and the environmental humidity should be controlled; |
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