Instructions for Use

Mixing – Use manual or automated equipment to uniformly mix the A and B components according to the specified weight ratio, ensuring thorough mixing. In applications sensitive to air entrainment, the mixed adhesive should be subjected to vacuum degassing at a vacuum level of at least –0.09 MPa for 2–3 minutes. , When the colloid content is high, the degassing time should be appropriately extended. The purpose is to remove air bubbles that have been entrained into the adhesive during mixing; otherwise, there is a certain probability that bubbles will appear both within the cured adhesive and on its surface. For large-scale production, automated metering, mixing, and dispensing equipment can be used.

Perfusion – Manual potting may be used, or automated potting equipment equipped with a vacuum‑extraction system and a heated material tank can be employed. Place the component to be potted horizontally with the opening facing upward, and within the working time, pour in the potting compound and allow it to self‑level. For components with complex structures or large volumes, apply the compound in multiple stages. Any trapped air bubbles can be removed by blowing them away with a hot‑air gun or similar tool, which will also eliminate surface‑floating bubbles.

Curing – It is recommended to allow the material to cure at rest in an environment of 20°C to 30°C, which helps minimize bubble formation; alternatively, cure it by gently heating at low temperature once no visible bubbles remain within or on the surface of the adhesive. 。 Curing time depends on the amount mixed each time and the temperature: larger quantities or higher temperatures will shorten the curing time, while smaller quantities or lower temperatures will lengthen it. A catalyst can significantly reduce the curing time.

Cleaning up – The uncured resin is relatively easy to clean; for cured resin, please soak it in a dedicated cleaning agent (such as thinner, dichloromethane, or plate‑washing solvent). However, be aware that these solvents may corrode components other than the adhesive, so use them with caution. After soaking, soften and carefully peel off the resin.

Precautions

A/B At low temperatures, the viscosity of both components increases, and Component B is prone to crystallization. Preheating the materials to 25–45°C can enhance adhesive flowability, preventing excessive viscosity and minimizing bubble formation.

This product is sensitive to moisture; exposure to humidity can lead to curing‑related bubbles. It is recommended to maintain the operating environment at 25°C ± 5°C, with relative humidity kept below 60%. Components prone to moisture absorption, such as PCBs and plastic enclosures, should be dried prior to potting; otherwise, microscopic air bubbles may form along the edges of the board or housing.

Storage and Shelf Life

This product is non‑hazardous. Store it away from light, in a cool, dry place, at a temperature of 15–25°C, using the original unopened container. Each component has a shelf life of six months from the date of manufacture. The expiration date is indicated on the label affixed to the outer packaging of each product. Products past their expiration date may only be used after their performance has been verified as satisfactory.

Please ensure proper storage of Component B and avoid exposing it to low-temperature environments. Maintaining an appropriate storage temperature will help minimize crystallization; should crystallization occur, please contact our technical team for assistance.

Note: The curing agent (Component B) is highly sensitive to moisture; after adding the curing agent, any remaining material should be tightly sealed and stored immediately. Once opened, Components A and B should be used up in one go whenever possible, or kept sealed and used within a short period. Alternatively, the container can be purged with nitrogen and resealed for storage.

Warning Information

Before using this product or any Hinnel product, please refer to the Material Safety Data Sheet (MSDS) and the product label for instructions on safe use and handling. If you have any questions, please feel free to contact us.

Shanghai Hinnel provides innovative adhesive solutions for bonding, sealing, potting, thermal management, and protection. Our team works closely with customers to help enhance the value of their products. In an ever-evolving market, we continuously innovate and respond swiftly, committed to delivering professional products and technical support to customers worldwide.