Instructions for Use

Pre-processing – Clean and prepare the surface of the material to be bonded or coated, using a cleaning agent to remove rust, dust, oil, and other contaminants.

Mixed – 400 ml dual‑tube packaging: Rotate 90° to unscrew the cap, attach the mixing tube, and load it into a professional manual, electric, or pneumatic caulking gun. For enhanced reliability, discard the first few drops of adhesive extruded from the mixing tube to prevent initial uneven mixing that could compromise bonding performance.

Note: The mixing tube is a consumable; if used beyond its recommended service life, it must be replaced.

Kilogram packaging: Use an automated metering/mixing/dispensing system to blend components A and B in the specified ratio, ensuring thorough mixing.

Sizing – After mixing the adhesive, apply it evenly to both surfaces to be bonded within the working time, then bring the surfaces together and hold them in position. Do not move the bonded assembly until the adhesive has gelled. Apply appropriate pressure to the substrates as needed to ensure full contact with the adhesive, thereby achieving optimal bonding performance.

Curing – It can be cured at room temperature by standing still, or it can be cured by low‑temperature heating. Before evaluating the product’s overall performance, it must be cured at room temperature for at least 7 days, or, after initial room‑temperature curing, undergo heat curing—e.g., at 60°C for 2 hours. Heat curing further enhances the adhesive’s performance.

Note: Curing time is significantly influenced by temperature and adhesive application rate, with slight variations observed under different temperature and application conditions.

Precautions

At low temperatures, Material A exhibits increased viscosity, while Material B is prone to crystallization. Preheating the materials to 25–45°C can enhance adhesive flow and help prevent excessive viscosity and excessive bubble formation. This product is sensitive to moisture; exposure to humidity may lead to curing‑induced bubbles. It is recommended to maintain the operating environment at 25±5°C, with relative humidity kept below 60%. Components such as PCBs and plastic enclosures that readily absorb moisture should be dried prior to potting; otherwise, tiny air bubbles may form along the edges of the board or plastic housing.

Storage and Shelf Life

This product is non-hazardous. Store it away from light, in a cool, dry place, at a temperature of 15–25°C, using the original unopened container. Each component has a shelf life of six months from the date of manufacture. The expiration date is indicated on the label affixed to the outer packaging of each product. Products past their expiration date may only be used after their performance has been verified to be within acceptable limits.

Note: The curing agent is highly sensitive to moisture; after adding the curing agent, any remaining material should be tightly sealed and stored immediately. Once opened, use the A/B components in a single batch whenever possible, or reseal the container after purging it with nitrogen.

Warning Information

Before using this product or any Hinnel product, please refer to the Material Safety Data Sheet (MSDS) and the product label for instructions on safe use and handling. If you have any questions, please feel free to contact us at any time.

Shanghai Hinnel provides innovative adhesive solutions for bonding, sealing, potting, thermal management, and protection. Our team works closely with customers to help enhance the value of their products. In an ever-evolving market, we continuously innovate and respond swiftly, committed to delivering professional products and technical support to customers worldwide.