Impact of Delamination in Potting Compound on Performance: 

(1) Causes of Stratification : Electronic potting compound is composed of Main materials, powders, and additives comprise the composition, Due to the varying densities of the individual components, prolonged standing can cause the denser materials to settle, resulting in a stratification where the powder settles at the bottom and the oil rises to the top. 

(2) Tiered classification within the validity period If delamination occurs within the shelf life and is not persistent, simply mix the colloid thoroughly before normal use; this will not affect its performance. For example, after thorough mixing, key parameters such as the colloid’s viscosity, curing rate, and thermal dissipation performance can all be restored to their normal levels. 

(3) Layered classification upon expiration of the validity period : If the product has exceeded its shelf life at the time of layering, the additive’s activity may have diminished. Even after thorough mixing, parameters such as gelation time, hardness, or insulating properties may still vary. Affecting the actual user experience 。

(4) Consequences of Uneven Mixing : If the colloid is not thoroughly stirred after layering, it may exhibit Abnormal viscosity, lightening of color, incomplete curing, or degraded thermal performance These issues can directly lead to performance failure. For example, a colloid that has not been thoroughly mixed may fail to cure completely due to insufficient local concentrations of additives, resulting in a brittle structure. 

Precautions for storing potting compounds: 

1 , Temperature control: Store at room temperature, protected from light. Place 10 ~ 25℃ ; Avoid direct sunlight, proximity to ovens, inverters, and heat‑generating equipment; high temperatures accelerate filler settling and significantly hasten delamination; low temperatures generally do not cause delamination, but epoxy resins are prone to crystallization at low temperatures. 

2 , Protect from light and moisture: Store cardboard boxes away from light; ultraviolet radiation can degrade the resin and accelerate the precipitation and delamination of additives. Keep the warehouse dry to prevent moisture from entering the containers, as moisture can cause fillers to agglomerate and settle. 

3 , Standing and Placing: Store the drum upright and flat; do not invert or lay it on its side. Prolonged lateral storage can cause the packing material to accumulate against the drum wall, making thorough mixing difficult. 

Shelf life of common potting compounds: 

1 , Standard shelf life: Epoxy 6  month, silicone 12  month, polyurethane 6  months; The closer the product is to its expiration date, the higher the likelihood of layering. 

2 , long-term standing (exceeding 1  months): Before use, the entire container must be stirred; for large containers, low-speed stirring is recommended. 5 ~ 10  For a few minutes, manually stir the small bucket thoroughly until no sediment remains. 

What are the advantages of electronic potting compounds? 

1 , Excellent electrical insulation performance: 

After curing, potting compounds form a dense insulating layer, significantly enhancing the electrical insulation performance of electronic components and preventing short circuits and leakage currents. 

2 , Excellent weather resistance and strong anti-aging performance: 

Encapsulating potting compounds maintain stable performance under harsh environmental conditions—such as high and low temperatures, and fluctuating humidity—thereby extending the service life of electronic components. 

3 , Strong seismic and impact resistance: 

After curing, potting compounds exhibit a certain degree of elasticity and toughness, effectively absorbing and dissipating external vibrations and impact forces to protect electronic components from damage. 

4 , Excellent heat dissipation performance: 

Some potting compounds exhibit excellent thermal conductivity, enabling rapid heat dissipation from electronic components and enhancing the thermal stability and reliability of the equipment. 

5 , Simple construction: 

Encapsulating adhesive exhibits excellent fluidity and workability, allowing for dispensing by hand or via automated equipment, thereby enhancing operational efficiency. 

In summary, delamination of adhesives can compromise their performance; therefore, special care should be taken during storage and application to prevent this issue. Additionally, when selecting an adhesive, it is advisable to choose products that are reliable and exhibit excellent stability to ensure optimal bonding results. For example, Hinnel New Materials has been deeply engaged in the field of electronic potting compounds. Its products feature uniformly dispersed fillers, long-term storage stability with minimal delamination, and compatibility with a wide range of applications, including power supplies, controllers, and automotive electronics.

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