Power electronic devices are systems that use power electronic components as their core functional elements, enabling electrical energy conversion and control to manage power. They primarily include inverters, converters, rectifiers, and electronic switches, and are widely employed in industrial automation, renewable energy generation, grid stabilization, and transportation, among other fields. Their key components encompass uncontrolled devices (such as diodes), semi‑controlled devices (such as thyristors), and fully controlled devices (such as IGBTs and MOSFETs), which, through high‑frequency switching, accomplish essential functions like AC–DC conversion and voltage regulation.

Power electronics hardware components include power semiconductor devices, chips, modules, capacitors, inductors, and more.

I. Power Semiconductor Devices

Power semiconductor devices are the core components of power electronics. It refers to electronic devices that can be directly used in the main circuit for processing electrical energy, enabling the conversion and control of electrical power. Based on the degree to which they can be controlled by control circuit signals, power electronic devices are classified as follows: (1) semi‑controlled devices, such as… Thyristor ; (2) Fully controlled devices, such as the GTO (Gate Turn-Off Thyristor), GTR ( Power transistor ), Power MOSFET (power) Field effect transistor, IGBT (insulated-gate bipolar transistor); (3) uncontrolled devices, such as Power diode 。 Products in the power electronics sector are extensively used for electrical energy conversion, control, and regulation, and their application environments place stringent demands on adhesives’ high‑temperature resistance, electrical insulation, thermal conductivity, and vibration‑damping properties. The following outlines the main product categories, the corresponding adhesive types, and the intended purposes of these adhesives:

II. Classification of Power Electronics Products and Adhesive Requirements

1. Power semiconductor modules (thyristors, IGBT/SiC modules)

Adhesive type:

Thermal interface materials (such as thermal grease, thermal gel, and thermally conductive adhesive) are used to facilitate heat transfer between the chip and the heat sink.

Silicone gel: protects the chip from moisture, dust, and mechanical stress.

Conductive silver adhesive: used for conductive bonding between chips and substrates.

Epoxy potting compound: protects the chip from moisture, dust, and mechanical stress.

Purpose: heat dissipation, insulation, moisture resistance, and seismic resistance.

2. Power equipment (UPS, inverters, charging stations)

Adhesive type:

Epoxy potting compound: used to encapsulate components such as transformers and inductors.

Polyurethane adhesive: used to seal the housing, providing dustproof and waterproof protection.

Silicone conformal coating: used to protect circuit boards from moisture and dust.

Purpose: insulation, heat dissipation, corrosion resistance, and shock absorption.

3. Capacitors/Inductors/Transformers

Adhesive type:

Epoxy adhesive: used to secure the magnetic core or coil.

Silicone rubber: Used for potting high-frequency transformers; it is heat-resistant and flexible.

Purpose: to secure the structure, reduce noise, and prevent moisture.

4. PCBs and electronic components

Adhesive type:

UV adhesive: rapidly cures to secure components.

Red adhesive (epoxy adhesive): Used for temporary component fixation during SMT assembly.

Conformal coating (acrylic/polyurethane): protects against moisture, salt spray, and mold.

Purpose: to prevent short circuits, prevent oxidation, and provide mechanical fixation.

5. Cooling System (Heat Sinks, Fans)

Adhesive type:

Thermal conductive silicone: bonds heat sinks to power devices.

Structural adhesive (acrylate): secures the fan bracket.

Objective: High thermal conductivity and vibration resistance.

6. Sensors/Relays

Adhesive type:

High-temperature-resistant epoxy adhesive: seals sensitive components.

Instant adhesive (cyanoacrylate): Quickly secures cables.

Purpose: Dust-proof, moisture-resistant, and chemically corrosion-resistant.

7. Puncture wire clamp

Adhesive type:

Insulating, energy-saving grease: sealing for piercing wire clamps

8. Recommended Adhesive List for Power Electronic Devices and Accessories

III. Core Performance Requirements for Power Electronics Adhesives

High-temperature resistance: Must withstand temperatures from −40°C to 200°C (e.g., SiC modules can operate at temperatures exceeding 175°C).

Electrical insulation: High dielectric strength (e.g., potting compounds must exceed 15 kV/mm).

Thermal conductivity: Thermal conductivity coefficient of 1–5 W/m·K (e.g., thermal grease).

Seismic resistance: Flexible adhesives (such as silicone) help mitigate mechanical stress.

Weather resistance: UV-resistant and aging-resistant (for outdoor equipment such as photovoltaic inverters).

IV. Typical Application Cases

New energy vehicle electronic control unit: thermal conductive gel plus epoxy potting compound, addressing high‑power‑density thermal management challenges.

Photovoltaic inverters: Silicone potting compounds protect the circuitry and withstand outdoor temperature fluctuations.

Industrial inverters: Polyurethane sealant prevents dust ingress.

Shanghai Hinnel provides innovative adhesive solutions for bonding, sealing, potting, thermal management, and protection. Please contact Hinnel New Materials via online customer service, website messages, phone calls, or email to obtain free samples and technical support!