Reference parameters for potting compound selection:

1 , Thermal Conductivity Requirements:

High-power-density modules (such as fast-charging power supplies and server power supplies) require the selection of materials with high thermal conductivity. ≥0.8 W/(m·K) The rubber compound, such as silicone, has a thermal conductivity of 1.2 W/(m·K) , can meet 500 W/m² Heat flux density requirement.

2 , Temperature Resistance Grade:

The long-term operating temperature exceeds 100℃ Scenarios (such as photovoltaic inverters) require the selection of temperature‑resistant components. 250℃ of silicone rubber, whereas in low-temperature environments ( -40℃ The following requires polyurethane adhesive.

3 , Flame-retardant requirements:

Safety-sensitive sectors such as rail transit and new-energy vehicles require careful selection. UL94-V0 Flame-retardant rubber compounds, such as epoxy rubber, oxygen index ≥32% , vertical burning time <10 Seconds.

4 , Process Compatibility:

Automated production lines require the selection of adjustable operation times (e.g., 30-180 rubber compound (in minutes), whereas for manual operations, a fast-curing type should be prioritized ( 80℃ down 15 Minute curing).

Selection of potting compound for power modules:

Epoxy resin is a highly durable, high‑strength adhesive that, once cured, exhibits excellent resistance to heat and chemical corrosion. However, because its curing process requires a specific duration and the use of a hardener, it is essential to ensure that the curing time meets the specified requirements.

Typical Application Cases ‌： Customized high‑thermal‑conductivity epoxy potting compound for industrial high‑power power modules, with thermal conductivity increased to 1.8 W/(m·K) Above, the steady-state operating temperature of the module’s core power components is approximately lower than that of the standard potting‑encapsulated version. 15℃ , significantly extending the service life.

Recommended adhesive: Hinnel HN6225D Epoxy potting compound After mixing, it exhibits moderate viscosity, excellent self-leveling properties, and easy defoaming. It can effectively fill voids within motor stators and rotors, transformer windings, and various electronic modules. Upon low‑temperature heating, it cures rapidly with minimal exothermic heat and very low shrinkage, yielding a cured product that offers long‑term resistance to… 200℃ It exhibits excellent resistance to cracking under high-temperature and thermal cycling conditions, making it suitable for a wide range of electrical and electronic module packaging applications.

After curing, silicone potting compound forms an elastic, soft elastomer with a wide temperature‑resistance range. -50℃~250℃ , exhibits excellent resistance to thermal shock, with a thermal conductivity as high as 3.0 W/m·K , featuring excellent reworkability, it can be easily disassembled to replace internal components.

Typical Application Cases ‌：2000W The aforementioned high-power communication power modules employ a custom high‑thermal‑conductivity silicone potting compound, which can reduce the temperature of critical hotspots by approximately… under full‑load operation. 22°C , after 500 Next -40℃ To 85℃ After the temperature cycling test, the colloid showed no cracking, and its insulation performance remained stable.

Recommended adhesive: HNSIL8730 Organosilicon thermally conductive potting compound It exhibits low viscosity, excellent flowability, and outstanding self‑degassing capability after mixing, making it well suited for encapsulating a wide range of electronic modules. It can cure at room temperature or be accelerated by heating, is environmentally friendly—free of solvents and toxic byproducts—and features low curing shrinkage and minimal stress on components. The cured adhesive forms a glossy surface while delivering superior flame retardancy and electrical insulation performance.

Typical application scenarios for potting compounds

• 5G Base station power module: Designed to withstand extreme outdoor temperature fluctuations and continuous vibration, ensuring stable signal transmission.
• Industrial power modules: significantly enhanced resistance to mechanical shock, designed to meet the demanding conditions of factory environments.
• LED Driver power supplies and automotive electronic charging modules: provide waterproof sealing and stress buffering, and are compatible with a wide range of indoor and outdoor devices with low to medium heat dissipation.
• Photovoltaic inverters, Electric Vehicle Chargers and other new-energy equipment: Rely on elasticity and insulation to deliver long-term, reliable protection.

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