Analysis of Common Problems During Epoxy Potting Compound Application
During the encapsulation process of electronic components using epoxy potting compounds, several common issues may arise, such as air bubbles, easy detachment, and incomplete curing. These problems not only affect the filling performance of the potting compound but can also negatively impact the performance and reliability of the electronic components themselves. So, how can these issues be addressed?
Shanghai Hinnel
2026/01/29

Ⅰ.The glue does not cure or cures incompletely.
Reason: It is generally caused by inaccurate mixing ratios or uneven mixing of the two-component mixture.
[Solution]
Use an electronic scale for accurate weighing (precision: ≥0.1 g ), absolutely no visual estimation of proportions is allowed; strictly adhere to the weights specified by the manufacturer. / Volume ratio: When preparing the adhesive in batches, be sure to mark each batch clearly and maintain consistent ratios across all batches. The amount of adhesive prepared should be determined based on construction efficiency to avoid wasting sealant by preparing excessive amounts at one time.
II. After curing, the surface is not smooth or has bubbles.
Reason: Bubbles were introduced during the mixing or dispensing of the adhesive; the curing speed was too fast; the exothermic temperature was high; the adhesive exhibited a large shrinkage rate upon curing; or excessive amounts of solvents and plasticizers were added to the adhesive.
[Solution]
Eliminate bubbles by means of vacuuming, heating to reduce viscosity, adding a diluent to lower viscosity, or incorporating an antifoaming agent. Adjust curing conditions, such as lowering the curing temperature or extending the curing time.
Ⅲ. After curing, the adhesive lacks sufficient strength and is prone to peeling off.
Reason: The root cause is inadequate substrate preparation. Oil stains and dust form a barrier, resulting in poor adhesion on smooth surfaces.
[Solution]
Quickly remove oil using acetone—suitable for metals, glass, and more. 80 Use coarse-grit sandpaper for roughening the surface. For porous materials (such as wood and concrete), apply a primer coat in advance to seal the pores. When applying the adhesive, first apply a thin coat and press firmly to expel air bubbles, then apply a thicker coat to enhance the adhesion between the adhesive layer and the substrate.

Ⅳ. Cracking of the adhesive layer and embrittlement of its texture
Reason: Primarily due to ultraviolet radiation exposure or the use of conventional formulations.
[Solution]
Operate strictly according to the prescribed mixing ratio and never exceed the recommended amount of curing agent. After curing, avoid sudden temperature changes—both extreme cold and extreme heat. In outdoor environments or scenarios with significant temperature fluctuations, choose a flexible modified adhesive or add a small amount of toughening agent to enhance crack resistance and reduce the impact of thermal stress.
V. Color Change of the Solidified Material
Reason: Color changes are influenced by conditions such as curing temperature and ultraviolet light.
[Solution]
Choose a potting compound with excellent weathering resistance to avoid prolonged exposure to intense light sources such as ultraviolet radiation.
Use Epoxy potting compound If any of the above situations occur, the solutions are as follows:
✅ Before use, check whether the glue packaging is intact and within the expiration date.
✅ Pay attention to the process during operation; be sure to mix thoroughly before combining the adhesives. A Apply the adhesive, then accurately mix it according to the weight ratio specified in the manufacturer’s instructions. After thoroughly blending the mixture, proceed to encapsulate the product.
✅ The encapsulated product can cure at room temperature. If you want to accelerate curing by heating, the oven temperature needs to be adjusted to: 30-60 The temperature must not exceed the glue’s temperature resistance range.
The above are common issues encountered during the use of epoxy potting compounds, along with their corresponding solutions. For more information on the performance and related details of our potting compound products, please feel free to call us for a detailed consultation.
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