When selecting potting compounds for microinverters, what should you prioritize?
Microinverters are exposed for extended periods to outdoor conditions on rooftops, enduring harsh environments characterized by high temperatures, humidity, and ultraviolet radiation. In many cases, product failures are not due to the components themselves but rather to improper adhesive selection, which can lead to hidden issues such as cracking, leaching, and delamination. Therefore, adhesives used in inverters must be chosen based on the specific application requirements.
Shanghai Hinnel
Aug 13,2026

Background on the demand for adhesives used in microinverters
Microinverters are a core component of photovoltaic systems, responsible for converting the direct current generated by solar panels into alternating current. They typically operate outdoors and must withstand extreme environmental conditions—such as high and low temperatures and high humidity—as well as prolonged, heavy‑duty operation. Therefore, the adhesive-based approach must focus on addressing the following issues:
Environmental adaptability : Resists UV radiation, temperature fluctuations, and rainwater erosion, thereby extending equipment lifespan.
Electrical Safety : Ensure insulation performance to prevent leakage current or short circuits.
Thermal management : Efficient heat conduction prevents localized overheating that can degrade performance.
Structural stability : Internal components are secured by adhesive sealing, reducing vibration‑induced damage.
As a key component of photovoltaic systems, microinverters are installed outdoors for extended periods, continuously subjected to extreme weather conditions and demanding operating environments. Hinnel’s new‑material potting compound combines outstanding weather resistance, waterproofing and moisture protection, high and low temperature tolerance, and excellent thermal conductivity, effectively enhancing the microinverter’s environmental resilience and service life, reducing the frequency of failures, and ensuring the safety and stability of the photovoltaic system.

Core Adhesive Application Points and Solutions
1. Potting of microinverters
Function : Potting compound is used to fill internal voids within the inverter, encapsulate electronic components, and provide comprehensive protection against moisture and dust ingress, while also enhancing thermal dissipation.
Recommended Products: HN8730N Self-adhesive silicone thermal-conductive potting compound
Product Features and Benefits
- It can cure at room temperature or be rapidly cured by heating.
- Environmentally friendly, non-toxic, solvent-free, and free of curing by-products.
- The cured product exhibits excellent flame retardancy and electrical insulation properties.
- Low mixed viscosity, excellent fluidity, and outstanding self-deaeration performance.
- During curing, both the shrinkage rate and the stress experienced by the encapsulated component are low.
- The cured product is adhesive and exhibits strong adhesion to plastics and metal housings, thereby providing superior waterproof performance.
Applicable scenarios: Designed for potting and protecting electronic components in applications requiring thermal conductivity and waterproofing.
2. Adhesive sealing of microinverter housings
Function : The enclosure sealant is used to bond the upper and lower covers of the inverter, creating an airtight and watertight barrier that prevents external moisture and dust from entering, while also withstanding mechanical vibration and thermal expansion and contraction.

Recommended Products: HNSIL 736 Organosilicon Adhesive Sealant
Product Features and Benefits
- Single-component, easy to use, fast-curing
- Low odor, low volatility, and non-corrosive during curing.
- Excellent chemical resistance and weatherability, with strong adhesion.
- It cures to form a flexible rubber elastomer that resists moisture, contaminants, and other atmospheric constituents.
- Excellent heat and cold resistance, in -60-200℃ Stable adhesive sealing performance
Applicable scenarios: Specifically designed for applications requiring strong yet flexible adhesion, such as bonding materials with differing coefficients of thermal expansion—e.g., glass to metal or glass to plastic.
Common issues with adhesives used in microinverters:
Q: Why does potting compound perform fine at room temperature, but crack and delaminate after high–low temperature cycling?
Answer: Mostly a mistake. Using rigid epoxy potting compound, the thermal expansion and contraction stresses are significant, and… PCB , Mismatch in the thermal expansion coefficients of components. Silicone sealant exhibits minimal cracking, but it should not be used without a primer. / Plasma treatment can lead to interfacial debonding, resulting in waterproofing failure.

Q: The machine shows no obvious damage, but after prolonged operation, it occasionally experiences electric leakage and poor contact?
Answer: Most likely is Low-end organosilicon small-molecule silicone oil precipitates, and… PCB , an oil film forms on the connector surface, It causes latent insulation drift and poor contact, making it a common hidden fault in microinverters.
Q: After potting, bubbles often appear—do they affect reliability?
Answer: The impact is significant. Bubbles degrade insulation and thermal conductivity while creating pathways for moisture ingress, which can lead to corrosion and short circuits during prolonged outdoor use.
Q: After the housing sealant ages, does it delaminate and leak?
Answer: Most cases involve the improper use of architectural glass sealant in place of adhesive. Construction adhesive resistance UV , poor resistance to damp heat and also prone to corrosion PC/ABS Housing, Unable to meet 25 Annual outdoor operating conditions.
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