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china resin potting compound

The Resin Potting Compound is a high-performance material designed to encapsulate and protect sensitive electronic components from harsh environmental conditions. This versatile compound offers excellent resistance to moisture, chemicals, and thermal stress, ensuring long-term reliability for applications in automotive

Durability and versatility

Various applications, tailored solutions

Epoxy potting compounds have excellent physical properties such as insulation, compression resistance, moisture and heat resistance, and high bonding strength, which make them widely used in many fields. Whether in motors, electronics, power, medical equipment, the automotive industry, or aerospace, epoxy potting compounds play an important role.

The epoxy potting compounds developed and produced by Hinnel have a rich product and technology reserve in key performance areas such as high temperature resistance, high toughness, low stress, high strength, high adhesion, and crack resistance, capable of meeting various application scenarios.

At the same time, we can adjust various indicators according to customer process requirements. We use advanced equipment to simulate customer production conditions and test the adhesive formulations and applications, which helps determine the suitable products.

Product applications: potting protection for automotive electronics and sensors; insulation potting for transformers, capacitors, and current transformers; potting for automotive ignition coils and explosion-proof power supplies; bonding and sealing of water treatment membrane components; waterproof potting for smart water meter controllers; potting for industrial linear motors, fan motors, new energy; potting for various motor stators such as automotive drive motors.

The Resin Potting Compound is a high-performance material designed to encapsulate and protect sensitive electronic components from harsh environmental conditions. This versatile compound offers excellent resistance to moisture, chemicals, and thermal stress, ensuring long-term reliability for applications in automotive, aerospace, and industrial electronics. Its low viscosity allows for easy pouring and precise filling of intricate molds, while its superior adhesion properties prevent delamination over time. Whether used for transformers, sensors, or circuit boards, the Resin Potting Compound delivers unmatched durability and insulation.

One of the key advantages of this Resin Potting Compound is its exceptional thermal conductivity and electrical insulation. It effectively dissipates heat, preventing overheating in high-power devices, while maintaining dielectric strength to avoid short circuits. The compound cures quickly at room temperature or with mild heat, reducing production downtime. Its flexibility accommodates thermal expansion, minimizing stress on delicate components. Engineers trust this Resin Potting Compound for its ability to enhance product lifespan and performance in demanding environments.

In addition to its technical benefits, the Resin Potting Compound is formulated with eco-friendly materials, complying with RoHS and REACH regulations. It emits minimal volatile organic compounds (VOCs) during curing, ensuring a safer workplace. The compound is available in various formulations, including epoxy, polyurethane, and silicone, to meet specific application requirements. Its UV stability makes it suitable for outdoor use, while its resistance to vibrations and shocks ensures protection in dynamic settings.

Choosing the right Resin Potting Compound is critical for optimizing device performance and longevity. Our product offers customizable viscosity, cure time, and hardness options to match your project needs. Backed by rigorous testing and industry expertise, this compound is the ideal solution for sealing and safeguarding critical electronics. Trust the reliability of our Resin Potting Compound for your next high-stakes application.

ModelQuality RatioMixing ViscosityOperation TimeCuring TimeCuring HardnessThermal ConductivityColorTemperature Resistance RangeFlame Retardant LevelMain Characteristics
A:Bcps 25℃min 25℃min 25℃ShoreW/m.k-UL94
HNEP9001100:201200±20050±1025℃×24h or 80℃×2h85D0.5Black-40~120-General-purpose epoxy potting adhesive, long operation time, bright and smooth surface.
HNEP9002100:20800±20030±1025℃×12h or 60℃×1h85D0.6Black-40~120V-0Excellent flame retardant performance, 3mm V-0, bright surface after curing, excellent bubble release performance, fast curing speed, can be potting in large volumes without explosion.
HNEP62203:1300±100≥4025℃×24h or 50℃×1h80D0.2Transparent-40~120-Low viscosity, transparent and yellowing resistant, moderate curing speed, good consistency in high and low temperatures after curing, has toughness, low stress, good adhesion to metal and plastic housings, excellent water resistance and waterproof sealing.
HNEP62303:1300±100≥4025℃×24h or 50℃×1h60A0.2Transparent-40~120-Low viscosity, transparent and yellowing resistant, moderate curing speed, soft and elastic after curing, good adhesion to metal and plastic housings, excellent waterproof performance.
HNEP6225100:151200±20040±1025℃×24h or  80℃×2h80D0.5Black-40~150V-0Low shrinkage during curing, good toughness of the cured product, good electrical performance, excellent mechanical properties and adhesion, resistant to high and low temperatures and thermal shock.
HNEP6225D100:82000 (40℃)40±1080℃×2~4h>85D>0.8Black-40~230V-0

Amine-based, specially developed for applications in motor stators, transformer coils, and devices requiring high hardness, high thermal conductivity, and low thermal expansion coefficient. This epoxy system has high-temperature stability and excellent electrical insulation.

HNEP9220100:253000±100070±1525℃×24h or 80℃×4h90±50.5Black-40~230V-0Amine-based, ultra-high temperature resistant epoxy potting adhesive, long operation time, can cure at room temperature or with heat, specially designed for potting products that require high-temperature resistance.
HNEP6300100:10012000±2000>3h100℃×2h+120℃×2h85D0.8Black-40~150V-0High TG, flame retardant, thermally conductive, heat resistant, crack resistant, good adhesion to metal and plastic, very low shrinkage rate, resistant to dual 85% >1000h, resistant to -40~125℃ thermal cycling >200, and high-temperature storage tests, the gel does not crack or delaminate.
HNEP6310100:301500±5006~8h80℃×2h+120℃×2h or 90℃×4h85D0.6Black-40~160V-0Low viscosity, good permeability, temperature resistant, thermal shock resistant potting adhesive, suitable for potting small temperature-resistant and crack-resistant components.
HNEP6320100:1001900 (60℃)>3h (60℃)

110℃×2h+120℃×2h+

150℃×2h+180℃×2h+210℃×2h

951.9GrayTG>200V-0Ultra-temperature resistant, low viscosity epoxy potting adhesive, suitable for potting motor stators, transformer coils, and other devices with small diameter compact windings, excellent high-temperature stability and electrical insulation, resistant to thermal shock. Resistant to -45~200℃ thermal cycling.