Reasons and solutions for epoxy potting compound bubble generation
Epoxy potting compound, as an important sealing material, is widely used in electronics, electrical appliances, automobiles and other fields. During the curing process of epoxy potting compound, the generation of bubbles not only affects the appearance quality of the product, but may also affect its performance and service life. So, what are the reasons for the generation of bubbles? How to solve it?
Shanghai Hinnel
2025/08/12
I. Causes and Solutions of Bubbles During Mixing:
During construction, there may be Epoxy potting compound bubbles. This is mainly because when the colloid contacts the air, the air is encapsulated in the colloid. To solve this problem, ensure that the working environment is dry and dust-free before construction, and avoid direct exposure to air. At the same time, the mixing process can be appropriately increased to release the air in the colloid.
II. Causes and Solutions of Bubbles During Curing:
During the polymerization reaction curing process of epoxy resin, tiny bubbles will aggregate due to heating and expansion, forming large bubbles. In addition, chemical instability, mixing problems when adding thickeners, foaming reactions after thickener aggregation, the slurry discharge process, and improper operation during resin mixing can all lead to bubble formation.
These bubbles not only affect the appearance and quality of the product, but may also lead to reduced construction efficiency, VCM gas-phase polymerization and other problems. Therefore, eliminating bubbles is an important aspect of the production and use of epoxy resin adhesives.
To solve the bubble problem, the following methods can be tried:
1 Use vacuum degassing device during resin adjustment to ensure that there are no bubbles or impurities in the resin.
2 Properly increase the curing temperature and extend the curing time to allow sufficient time for the bubbles to escape.
3 Dry the electronic components before use to remove surface moisture.
4 Add an appropriate amount of defoamer, but pay attention to its effectiveness.
III. Preventive Measures
1. Material Selection
Low-viscosity adhesive: Select a model with good fluidity (e.g., epoxy adhesive viscosity < 2000cps ).
Defoaming formula: Potting adhesive containing defoamer.
2. Mixing and Degasification
Stir at a constant speed in a fixed direction (e.g., clockwise) 10-15 minutes, avoiding violent shaking.
Vacuum degassing : After mixing, the resin is treated in a vacuum environment ( 0.08-0.1MPa ) 5-10 minutes to thoroughly remove bubbles.
3. Substrate Treatment
Porous substrate: First apply a sealing primer (such as epoxy primer) to prevent the escape of gases from the pores.
Preheat substrate: 40~60 ℃ Preheat metal or plastic parts to reduce temperature difference bubbles.
Through comprehensive process control, material selection, and environmental management, bubble problems can be significantly reduced, ensuring the performance and reliability of the potting product. If the above solutions still cannot solve the problem, please leave a message on the website to contact us for more technical support and suggestions.
° Send email to sales@hinnel.com Email ;
° Call technical support +86-18301723907 Consultation.
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