Addition-cure potting compound is a sealing material widely used in electronics, automobiles, aerospace, and other fields. Its characteristics include good insulation, shock resistance, temperature resistance, and high bonding strength. 

Addition-cure silicone thermally conductive potting compound Instructions 

Mixing:   Before mixing, check each component for filler sedimentation. If sedimentation occurs, stir it evenly first. Then, use manual or automatic equipment to A/B mix the components proportionally ( by weight ) evenly until the color is uniform. For mass production, automatic metering can be used / mixing / equipment. 

Potting:   Manual potting or automatic potting equipment with a stirring device and a material tank insulation device can be used. Place the part to be potted horizontally with the potting port facing upwards, and pour in the potting compound within the operable time and allow it to self-level. 

Curing:   Cure according to the curing temperature in the product technical parameters. The curing time of addition-cure products largely depends on the temperature, size, and thermal conductivity of the product being potted. In short, the higher the temperature at which the gel is heated, the faster the curing. 

Here, in the relationship between curing temperature and time, the time refers to the curing time after the material reaches the target temperature. Consider the heating process of the oven itself, components with strong heat storage capacity, or other situations that may delay the material from reaching the target temperature.

Condensation-cure potting compound is a high-performance sealing material suitable for potting and protecting various electronic devices and instruments. Its characteristics include good weather resistance, UV resistance, waterproof performance, and excellent insulation performance. 

Instructions for using condensation-cure silicone thermally conductive potting compound 

Mixing:   Before mixing, check A component for filler sedimentation. If sedimentation occurs, stir it evenly first (this operation is not required for transparent systems). Then, use manual or automatic equipment to A/B mix the components proportionally ( by weight ) mix evenly. For mass production, automatic metering can be used / mixing / equipment. 

Potting:   Manual potting or automatic potting equipment with a stirring device can be used. Place the part to be potted horizontally with the potting port facing upwards, and pour in the potting compound within the operable time and allow it to self-level. 

Curing:   Cure at room temperature. The curing time of condensation-cure products largely depends on the catalyst and environmental humidity. The curing of the gel is gradual from the surface inward, so the surface will cure faster, and the bottom of the gel will cure slower. Usually, condensation-cure potting compounds require 7 days to fully cure. 

Electronic components have certain requirements for adhesives, Silicone thermally conductive potting compound not only has stable dielectric insulation, but also has the advantages of thermal conductivity, high elasticity, high and low temperature resistance, and shock resistance. This is why many components choose silicone potting compound. To ensure that electronic components receive comprehensive and effective insulation, moisture-proofing, and protection, the potting compound instructions must be strictly followed.