1. Polyurethane Adhesive

The basic principle of polyurethane potting adhesive is that polyol resin andMDIcuring agent undergo cross-linking and curing under the action of a catalyst, forming a high molecular polymer. Polyurethane potting adhesive is used for potting electronic components, modules, power supplies, sensors, and other electronic components to improve their performance, enhance the integrity of electronic components, increase resistance to external impacts and vibrations, improve insulation between internal components and circuit boards, prevent direct exposure of components, enhance moisture-proof, waterproof, and corrosion resistance, improve heat dissipation of components, and enhance product stability and service life.

Hinnel has a wide range of innovative polyurethane potting adhesive products, with performance covering high and low temperature resistance (-60~150°C), resistance to dual85, resistance to thermal shock, suitable for manual or machine potting, widely used in potting protection of industrial-grade and automotive-grade electronic products.

2. Epoxy Adhesive

Epoxy resin potting adhesive has excellent insulation, compressive strength, moisture and heat resistance, and high bonding strength. These properties make epoxy resin potting adhesive widely used in many fields. Whether in motors, electronics, power, medical equipment, automotive industry, or aerospace, epoxy resin potting adhesive plays an important role.

The epoxy resin potting adhesive developed and produced by Hinnel has a rich product and technology reserve in key performance areas such as high temperature resistance, high toughness, low stress, high strength, high bonding strength, and crack resistance, meeting various application scenarios.

At the same time, it can adjust various indicators according to customer process requirements. We use advanced equipment to simulate customer production conditions and test the adhesive formulations and applications, which helps determine the suitable products.

3. Silicone Adhesive

Hinnel silicone thermal conductive potting adhesive is a room temperature/cured electronic potting material. After curing, it forms an elastic cushioning material with excellent high and low temperature resistance and weather resistance, while also having excellent electrical performance and chemical stability.

Hinnel offers a variety of products with different thermal conductivity coefficients, which can effectively conduct heat away from your components to ensure low thermal stress. Even under conditions of extreme temperature fluctuations, the material can maintain sufficient elasticity to reduce stress within the components.

To meet the different waterproof and thermal conductivity requirements of electronic products, Hinnel can provide various innovative products, including non-adhesive, self-adhesive, and adhesive types, while also adapting to customer requirements for curing time, viscosity, hardness, and other indicators, fully committed to providing excellent solutions for customer applications.

In addition to the three materials mentioned above, there are many other sealing materials suitable for electronic products. Different materials have different characteristics and application ranges. Choosing the right material based on the different requirements of electronic products and their environments can effectively improve product performance and maintain product quality.

In summary, the choice of sealing materials for electronic products has a significant impact on product quality and performance. Selecting the appropriate materials can enhance the sealing, water resistance, and shock resistance of products, making electronic products more stable and durable.

Note: Some images in this article are sourced from the internet. If there is any infringement, they will be removed immediately.