Power supply potting solution - polyurethane potting adhesive
The power supply is a crucial component in electronic devices, and its performance directly affects the efficiency and stability of the entire system. Polyurethane potting compound, as a high-performance insulating material, is widely used in the protection and sealing of power supplies. However, traditional potting compound solutions have many shortcomings, such as poor high-temperature resistance and aging resistance, which severely restrict the performance of the power supply. Next, Shanghai Hinnel New Materials Technology Co., Ltd. will introduce a power supply potting solution.
Shanghai Hinnel
2025/04/08

To address these challenges, this newly launched innovative solution employs advanced polyurethane technology and a unique formulation design, aiming to enhance the reliability and durability of the drive power supply. According to experimental testing, this solution offers the following significant advantages:
Protective Performance: It offers moisture-proof, waterproof, dust-proof, and corrosion-resistant properties, preventing moisture and dust from entering and causing short circuits or component failure. ; High temperature and aging resistance, 85 ,ensuring long-term stability in humid and hot environments.
Mechanical Performance: It has load-bearing capacity, supporting internal components to prevent damage from vibration or impact. 。
Potting Process: A unique potting process ensures that the potting compound uniformly covers the surface of the power supply components, forming a good sealing layer. This not only improves the waterproof performance of the power supply but also effectively prevents dust and impurities from entering the power supply, extending its service life.
Thermal Conductivity and Insulation: Thermal conductivity ≥ 0.5 W/(m·K) ,optimizing heat dissipation performance and reducing the risk of thermal failure in high-power density equipment. 。Stable electrical insulation performance is maintained after curing, isolating electromagnetic interference. 。
High Viscosity, Thixotropic: Hinnel polyurethane potting adhesive has high viscosity and thixotropic properties, effectively filling gaps and crevices inside the power supply module during the potting process, ensuring good potting results.
Anti-Toxicity: The polyurethane sealant has anti-toxicity properties, will not corrode or damage the internal components of the power supply, and ensures the long-term stable operation of the power supply.

Hinnel Drive Power Supply Potting Adhesive Instructions for Use :
Mixing: Before mixing, check A component for filler sedimentation. If sedimentation occurs, stir it evenly first (this operation is not required for transparent systems). Then, use manual or automatic equipment to mix the A/B components proportionally by ( weight ratio ) evenly. Thorough mixing is essential. In situations sensitive to gas mixing, the mixed adhesive should be degassed under a vacuum of -0.09MPa or higher for 3~5 minutes. For larger quantities of adhesive, extend the degassing time appropriately. The purpose is to remove air bubbles mixed into the adhesive during stirring; otherwise, there is a certain probability of air bubbles appearing inside and on the surface of the poured adhesive. For mass production, automatic metering / mixing / equipment can be used.
Pouring: Manual potting can be used, or automatic potting equipment with a vacuum device, stirring device, and material tank insulation device (no stirring device is needed for transparent systems) can be used. Place the item to be potted horizontally with the pouring port upwards, and pour in the potting adhesive within the operable time and allow it to self-level. For complex and large-volume components, , pouring should be done in multiple stages. Air bubbles can be removed by blowing with a hot air gun, etc., to remove surface bubbles.
Curing: It is recommended to allow it to cure at 20℃~30℃ for better degassing, or low-temperature curing after the internal and surface of the adhesive are free of obvious air bubbles. The curing time depends on the amount mixed each time and the temperature. Larger amounts or higher temperatures will shorten the curing time, while the opposite will lengthen it. Catalysts will significantly shorten the curing time.
Cleaning: The resin is easier to clean before curing. For cured resin, please use a special cleaning agent to soak it ( (e.g., thinner, dichloromethane, cleaning solution, etc., but it is not ruled out that the cleaning agent may corrode other components besides the adhesive, please use with caution), soften, and peel off.

In summary, using polyurethane potting adhesive to encapsulate drive power supplies has many advantages, improving performance, stability, and extending service life. Therefore, during production and use, appropriate polyurethane potting adhesive should be selected according to the specific situation. If you have any questions or needs, please feel free to contact us. We will wholeheartedly serve you and provide suitable protection solutions for your drive power supplies.
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